Electrochemical Processing in ULSI and MEMS 3

Electrochemical Processing in ULSI and MEMS 3

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The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.... CA 95135, USA Production of porous anodic aluminum oxide (AAO) films from 100 nm evaporated aluminum (on silicon) was ... To avoid these issues, possible applications of processing arrays of dots (or pillars) have been implemented to create ... that can be used as a preformed template for many applications in magnetic, electronic, and optical devices [2-3]. ... of hole diameter, interpore distance, and long-range order structure for future prospects in magnetic storage devices.

Title:Electrochemical Processing in ULSI and MEMS 3
Author: John O. Dukovic
Publisher:The Electrochemical Society - 2007-09

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